The latest bonding and inspection
equipment is used to manufacture
SOI and GeOI bonded wafers
equipment is used to manufacture
SOI and GeOI bonded wafers
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| Semiconductor Processing Company 12 Channel Street #702 Boston, MA 02210 Voice (617) 345-9936 FAX (617) 345-9271 |
Plasma activation lowers anneal temperatures,
enhances bond strength and also allows for
bonding of thermally mismatched materials.
enhances bond strength and also allows for
bonding of thermally mismatched materials.
CSAM
| Void Free |
| Void Detection |
Wafer Surface Characterization Standard Bonding or Plasma Bonding High Temp or Low Temp Annealing 100% Acoustic Interface Imaging |