The latest bonding and inspection
equipment is used to manufacture
SOI and GeOI bonded wafers
Semiconductor Processing Company
12 Channel Street #702
Boston, MA  02210
Voice (617) 345-9936
FAX (617) 345-9271
plasma activation
Plasma activation lowers anneal temperatures,
bond strength and also allows for
bonding of thermally mismatched materials.
scanning acoustic microscope
wafer bonder
Automated Wafer Bonder
Bonded Wafer Image
(SEM)Showing Our
Perfect Edge
Void Free
Void Detection

Wafer Surface Characterization
Standard Bonding or Plasma Bonding
High Temp or Low Temp Annealing
100% Acoustic Interface Imaging